VG Technologies mainly provides all kinds of double and multilayer printed circuit board in gold/silver/tin/OSP surface finishing, with gold connectors, carbon ink, heavy copper, high TG FR4 laminate material, and with complex technology: blind/buried vias (HDI), impedance control, conductive plug hole, peelable masks, BGA, countersink holes, half hole, via-in-pad, and variety of color photographic ink, provides Rogers/Nelco/Teflon laminate material PCB, high thermal conductivity MCPCB, while provides FPC manufacture service and one-stop turnkey service, widely used in home appliance, consumer electronics, automobile, medical device, aerospace, military, industrial fields.For more products information, please visit website http://www.shcircuits.com

4 Layers Half Hole PCB Material: FR4 TG150 1.6mm Copper thickness:  1/1/1/1 oz Surface finishing: ENIG Min hole size: 0.25mm, Min trace width/space:0.2/0.2mm	8 Layers rigid PCB Material: FR4,TG180, 1.60mm, Copper thickness: 2/2//2/2/2//2/2/2 oz Surface finishing: OSP Min hole size: 0.25mm, Min trace width/space: 0.12/0.12mm	2 Layers rigid PCB FR4,TG170, 0.5mm, Copper thickness: 1/1 oz Surface finishing: HASL lead free Min hole size: 0.5mm, Min trace width/space:0.25/0.25mm
1 Layer rigid PCB Material: FR4,TG135, 1.60mm, Copper thickness: 1oz Surface finishing: Immersion gold Min hole size: 0.5mm, Min trace width/space:0.3/0.3mm	6 Layers Gold Finger PCB Material FR4 TG150 1.6mm Copper thickness:  2/2/2/2/2/2 oz Surface finishing: ENIG Min hole size: 0.2mm, Min trace width/space: 0.1/0.1 mm	2 Layers MCPCB Material: Aluminum Base 1.6mm Copper thickness:  2/2 oz Surface finishing: ENIG Min hole size: 1.0mm, Min trace width/space: 0.8/0.8 mm